Low And Medium Molecular Weight Bisphenol A-Type Solid Epoxy Resin HW901 Solid Epoxy Resin HW901 is low and medium molecular weight bisphenol A-type solid epoxy resin, with fine chemical stability, strong adhesion and better toughness. It fits combining the amine curing agent or its addition compound that make up the reactive solvent coating compound. It can be hardening at room temperature or higher temperature. Because of these properties it finds use in various application